EEPROJ Selecting Low-End MCU for our projects
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Revision as of 21:19, 2 February 2022 by 21stCP Wiki BDFL (talk | contribs)
Introduction
TODO see other page why M4F.
IC Selection
Selection criteria:
Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.
For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.
The following MCUs fit "low-end" criteria for our projects:
| Microchip Technology | STMicroelectronics | NXP | |||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|
| Family | Family | Family | Family | Family | Family | Family | Family | Family | Family | Family | |
| Family Name | SAM E54 | SAM E53 | SAM E51 | SAM D51 | STM32F3 | STM32F4 | STM32G4 | STM32L4 | STM32L4R | STM32L4S | |
| Largest non-BGA package | 128-TQFP | 128-TQFP | 128-TQFP | 128-TQFP | 208-LQFP | ||||||
| Largest BGA package | 120-TFBGA | 120-TFBGA | 120-TFBGA | 120-TFBGA | 216-TFBGA | ||||||
| Features | With Ethernet and CAN | With Ethernet, without CAN | Without Ethernet, but with CAN | Without Ethernet or CAN | |||||||
| SPI | |||||||||||
| USB | |||||||||||
| Ethernet | |||||||||||
| Advantages | Documentation, community support, user base | ||||||||||
| Disadvantages | Limited pin count | ||||||||||
| Software | |||||||||||
