EEPROJ Selecting Low-End MCU for our projects
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Revision as of 21:10, 2 February 2022 by 21stCP Wiki BDFL (talk | contribs)
Introduction
TODO see other page why M4F.
IC Selection
Selection criteria:
Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.
For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.
The following MCUs fit "low-end" criteria for our projects:
| Microchip Technology | STMicroelectronics | NXP | |||||
|---|---|---|---|---|---|---|---|
| Family | Family | Family | Family | Family | Family | Family | |
| Family Name | SAM E54 | SAM E53 | SAM E51 | SAM D51 | STM32F4 | ||
| Largest non-BGA package | 128-TQFP | 128-TQFP | 128-TQFP | 128-TQFP | |||
| Largest BGA package | 120-TFBGA | 120-TFBGA | 120-TFBGA | 120-TFBGA | |||
| Features | With Ethernet and CAN | With Ethernet, without CAN | Without Ethernet, but with CAN | Without Ethernet or CAN | |||
