Difference between revisions of "EEPROJ Selecting Low-End MCU for our projects"
From 21st Century Products Wiki
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|+Low-End MCUs for our projects | |+Low-End MCUs for our projects | ||
! | ! | ||
! colspan="4" |Microchip | ! colspan="4" |Microchip Technology | ||
! colspan="2" |STMicroelectronics | ! colspan="2" |STMicroelectronics | ||
!NXP | !NXP | ||
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|Largest non-BGA package | |Largest non-BGA package | ||
| | |128-TQFP | ||
| | |128-TQFP | ||
| | |128-TQFP | ||
| | |128-TQFP | ||
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|Largest BGA package | |Largest BGA package | ||
| | |120-TFBGA | ||
| | |120-TFBGA | ||
| | |120-TFBGA | ||
| | |120-TFBGA | ||
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|Features | |Features | ||
| | |With Ethernet and CAN | ||
| | |With Ethernet, without CAN | ||
| | |Without Ethernet, but with CAN | ||
| | |Without Ethernet or CAN | ||
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Revision as of 21:10, 2 February 2022
Introduction
TODO see other page why M4F.
IC Selection
Selection criteria:
Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.
For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.
The following MCUs fit "low-end" criteria for our projects:
| Microchip Technology | STMicroelectronics | NXP | |||||
|---|---|---|---|---|---|---|---|
| Family | Family | Family | Family | Family | Family | Family | |
| Family Name | SAM E54 | SAM E53 | SAM E51 | SAM D51 | STM32F4 | ||
| Largest non-BGA package | 128-TQFP | 128-TQFP | 128-TQFP | 128-TQFP | |||
| Largest BGA package | 120-TFBGA | 120-TFBGA | 120-TFBGA | 120-TFBGA | |||
| Features | With Ethernet and CAN | With Ethernet, without CAN | Without Ethernet, but with CAN | Without Ethernet or CAN | |||
