Difference between revisions of "EEPROJ Selecting Low-End MCU for our projects"

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=== Introduction ===
TODO see other page why M4F.
 
=== IC Selection ===
Selection criteria:
 
Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.
 
For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.
 
The following MCUs fit "low-end" criteria for our projects:
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!NXP
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Revision as of 20:47, 2 February 2022

Introduction

TODO see other page why M4F.

IC Selection

Selection criteria:

Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.

For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.

The following MCUs fit "low-end" criteria for our projects:

Low-End MCUs for our projects
Microchip STMicroelectronics NXP
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