Difference between revisions of "EEPROJ Selecting Low-End MCU for our projects"

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Revision as of 21:19, 2 February 2022

Introduction

TODO see other page why M4F.

IC Selection

Selection criteria:

Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.

For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.

The following MCUs fit "low-end" criteria for our projects:

Low-End MCUs for our projects
Microchip Technology STMicroelectronics NXP
Family Family Family Family Family Family Family Family Family Family Family
Family Name SAM E54 SAM E53 SAM E51 SAM D51 STM32F3 STM32F4 STM32G4 STM32L4 STM32L4R STM32L4S
Largest non-BGA package 128-TQFP 128-TQFP 128-TQFP 128-TQFP 208-LQFP
Largest BGA package 120-TFBGA 120-TFBGA 120-TFBGA 120-TFBGA 216-TFBGA
Features With Ethernet and CAN With Ethernet, without CAN Without Ethernet, but with CAN Without Ethernet or CAN
SPI
USB
Ethernet
Advantages Documentation, community support, user base
Disadvantages Limited pin count
Software
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