Difference between revisions of "EEPROJ Selecting Low-End MCU for our projects"

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Revision as of 20:58, 2 February 2022

Introduction

TODO see other page why M4F.

IC Selection

Selection criteria:

Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.

For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.

The following MCUs fit "low-end" criteria for our projects:

Low-End MCUs for our projects
Microchip STMicroelectronics NXP
Family Family Family Family Family Family Family
Family Name SAM E54 SAM E53 SAM E51 SAM D51 STM32F4
Largest non-BGA package
Largest BGA package
Features
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