View source for EEPROJ Selecting Low-End MCU for our projects

=== Introduction ===
TODO see other page why M4F.

=== IC Selection ===
Selection criteria:

Only paying attention to Microchip Technology, STMicroelectronics, and NXP per TODO.

For low-end projects, will prefer non-FN, non-BGA packages, to significantly decrease project design cost, improve manufacturability, testability, repairability, and ability of CCA assembly without professional, precision, and high-cost equipment.

The following MCUs fit "low-end" criteria for our projects:
{| class="wikitable"
|+Low-End MCUs for our projects
!
! colspan="4" |Microchip Technology
! colspan="6" |STMicroelectronics
!NXP
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!
!Family
!Family
!Family
!Family
!Family
!Family
!Family
!Family
!Family
!Family
!Family
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|Family Name
|'''SAM E54'''
|SAM E53
|SAM E51
|SAM D51
|STM32F3
|'''STM32F4'''
|STM32G4
|STM32L4
|STM32L4R
|STM32L4S
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|Largest non-BGA package
|'''128-TQFP'''
|128-TQFP
|128-TQFP
|128-TQFP
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|'''208-LQFP'''
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|Largest BGA package
|'''120-TFBGA'''
|120-TFBGA
|120-TFBGA
|120-TFBGA
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|'''216-TFBGA'''
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|Features
|'''With Ethernet and CAN'''
|With Ethernet, without CAN
|Without Ethernet, but with CAN
|Without Ethernet or CAN
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|SPI
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|USB
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|Ethernet
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|Advantages
|Documentation, community support, user base
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|Disadvantages
|Limited pin count
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|Software
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